Photolithography

Photolithography is a technique that allows the creation of masks with computer assisted  optical direct writing. The pattern is projected directly onto the photoresin.

Plasma cleaner

Plasma cleaning is a technique that removes contaminants from surfaces by using plasma obtain from gas. Gases like argon or oxygen are used and mixtures of both. The plasma is obtained by excited gas with energy in a vacuum. Surfaces properties can be effectively altered, being useful for etching and activation processes, precision cleaning and polymerization on surface. 

Ellipsometer

Spectroscopic ellipsometry is useful to determine the thickness of thin films and optical constants of the materials (refraction index, extintion coeficient). It is a non-destructive optical analysis based on the polarization state change when light fall upon a material.

GES5E optical platform allows various measurements modes from standard ellipsometry to generalized ellipsometry going through photometric measurements (in transmission and reflection), scatterometry, luminescence measurements. All measurements are made automatically as a function of: wavelength, angle of incidence, polarization state and time. Standard spectral range is 230-900 nm.

Profilometer

The profilometer is a surface metrology analysis solution used in a wide range of applications in industries, form R&D departments to production monitoring. This surface analysis solution's precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials.

Atomic layer deposition (ALD) system 

The ALD system offers precise control of depositions down to the atomic scale. ALD is renowned for its film quality. The principle of ALD is based on sequential pulsing of special precursors vapours, each of which forms about one atomic layer on each pulse. Our equipment is designed to deposit pinhole free coatings that are perfectly uniform in thickness, even deep inside pores, trenches and cavities.

Infrared spectrometer

Infrared spectroscopy measures the interaction of infrared radiation with matter. It can be used to study and identify chemical compounds. Vertex 70 is a digital  FT-IR spectofophotometer  design for the adquisition of signal from far IR to the visible region. This equipment can do two types of measurements over the samples: absorbance and reflexion.

Reactive ion etcher (RIE)

RIE 2000 Reactive Ion Etcher allows anisotropic etchingof several materials. It is a turbo pumped system capable of reaching a base pressure of less than 10^-6 Torr. This low base pressure provides a clean etching environment and highly anisotropic etching. Nowadays, the RIE 2000 is equipped with oxygen (O₂), argon (Ar) and tetrafluoromethane (CF₄) gases, together with mixtures of oxygen/tetrafluoromethane.

Evaporation system

Evaporation System Auto 306 achieves high vacuum valuesfor an optimal physical deposition of the target to the sample. This technique allows very homogeneous coatings of gold (Au), chromium (Cr), aluminium (Al), titanium (Ti) and silver (Ag), among others and their mixtures.

Ion Milling

Ion Milling is a technique which allows to thin samples by argon (Ar) ions bombardment. 

Sputtering

Sputtering is a thin film deposition technique. The physical process consists of the evaporation of the atoms of the target due to the bombardment with energetic ions. It is possible to deposit  gold (Au), platinum (Pt), silver (Ag) y copper (Cu).

Contact angle

This equipment determines the contact angle and surface tension of a liquid in contact with a surface. It is possible to measure static and dynamic contact angles. 

Rheometer

The equipment allows rheological measurements (viscosity,  Young's Modulus, etc.) in fluids of interest.  The equipment can control speed or strenght.