Device and method for thermal diffusivity analysis
New device suitable to study thermal transport with enganced sensitivity to in-plate heat flow.
The study of in-plane thermal transport in bulk and low dimensional anisotropic materials is going to be crucial in next years as these materials are incorporated in applications such as electronics, thermoelectrics, and heat management devices.
The current devices and methods are complex, and may be influenced by the shape of the heat source and/or are mostly suitable for electrically insulating samples.
We present a new contactless device and method for studying thermal transport with enhanced sensitivity to in-plane heat conduction, which is based on beam-offset frequency-domain thermoreflectance using a onedimensional heat source with uniform power distribution. The method has been validated for free standing films, bulk samples (e.g. anisotropic crystals and substrates) and thin films on a substrate.